LOCTITE® 3515 is a one component epoxy adhesive, designed to allow self-alignment of SMT components during the reflow operation. The adhesive is pre-applied to the board at the corners of the CSP pad site using a standard SMA dispenser, a process that speeds assembly by eliminating post-reflow underfill dispense and cure steps. LOCTITE 3515 cures during the solder reflow phase to form a reliable bond, and contriutes to improvements in hand held device reliability. LOCTITE 3515 has excellent dispensing characteristics, good dot profile, and good on-board electrical characteristics. Reinforcement of CSPs with interposers or comerless arrays in portable electronic devices.
FEATURES:

• One component - requires no mixing
• Excellent dispensing characteristics
• Production - high speed curing